Chip-on-Board metal core PCB
Product Description
Chip-on-Board Metal Core PCB
Chip-on-Board Metal Core PCB (COB MCPCB) is a type of semiconductor assembly technology. Unlike the traditional assembly process, COB MCPCB has a micro-chip (which is also referred to as die). The micro-chip touches the metal core, which dissipates heat.
This forms an electrical interconnection between the chip and the trace on the board. Since, there is direct contact between the die and the board, there is no need for a dielectric layer. Thus, the thermal conductivity of the Chip-on-Board Metal Core PCB is the same as that of metal core material.
JHY PCB is a well-known manufacturer of Chip-on-Board Metal Core PCB, as well as rigid PCB, flexible PCB, rigid flex PCB, LED PCB, aluminum PCB.
Structure of COB MCPCB
What is COB?
COB, Chip On Board is a very popular and widely used LED package technology. Multiple bare diodes directly contact with MCPCB (Metal Core Printed Circuit Board) substrate to produce diode arrays on the same wafer or chip. When it lights up, it looks like a lighting panel.
With different diode arrays, COB chip can be designed to be different shapes, the common shapes are round, square, rectangle, circle ring. Meanwhile some innovative manufacturers had developed dual or triple CCT and RGB COB chips.
Currently there are two main COB technology, which are traditional COB chip and new flip COB chip.
What is the difference between traditional COB chip and flip COB chip?
The above picture show the schematic diagrams of a traditional wire-bond COB chip and no wire-bond flip COB chip.
A traditional COB chip is bonded on the Metal Core PCB substrate by bonding epoxy and connects to the circuit electrodes via two bonding wires. The thermal energy generated by the LED chip is dissipated through the diode's sapphire substrate, bonding epoxy, followed by a Metal Core PCB dielectric layer before reaching the metal core.
On the other hand, the flip COB chip has the LED diode directly bonded on the circuit electrodes without the bonding wire and epoxy. The heat generated by the LED is dissipated through circuit electrodes, MCPCB dielectric layer, and then diffused into the metal core.
In comparison, The advantages of flip COB chips are:
1. The traditional COB chip gets narrow illuminating light with 20% light is covered by bonding wires, while the light of flip COB chip gets no influence with no bonding wires.
2. Light decay is a natural characteristic for LED, the output lumen decreases when the LED junction temperature increases. Flip COB chip can minimize the light decay, because it gets better thermal management with efficient heat dissipation path.
3. Flip COB chip exhibits less heat resistance due to efficient heat disspation path, it can work under high current. So with high wattage, it can improve luminous efficacy (LM/W).
4. Traditional COB chip connects to the circuit electrodes via two bonding wires, these boding wires is possible to be broken during packaging or using. Flip COB chip don't need these bonding wires, removing a potential risk and reducing the defective rate.
The types of COB PCB
Currently there are there main types of COB PCB, which are Metal Core PCB (MCPCB), Mirro Aluminium PCB and Ceramic PCB.
1. MCPCB (Aluminium / Cooper + Silver Plating Process) gets low thermal conductivity at 1 - 3W/m.k with large heat resistance and reflectivity at 95%, thus it is suitable for small and middle power COB chip (Power < 10W).
2. Mirro Alumnium (Mirro Aluminium + Silver Placting Process) PCB gets high thermal conductivity at 170W/m.k with low heat resistance and reflectivity at 98%, thus it is suitable for large power COB chip (Power 10 - 50W).
3. Ceramic PCB gets good thermal conductivity > 24W/m.k, good reflecttivity > 95% and good dielectric strength > 15KV/mm. It is the trend to use ceramic PCB for COB module in future.
Comparison with SMD and high power chip
- COB chip can produce a large mount of lumen with just little energy, so it is more energy saving than SMD & high power chip.
- Due to the small size of diode and higher density of packaged diodes, COB chip can produce the light with higher intensity, then the luminous efficay (LM/W) is higher than SMD & high power chip.
- For COB chip, the light is illuminated from a face rather other a point (the light produced by SMD and high power chip is from a point) in order to make light greater uniformity, so glare will not be possibly formed.
- The diodes on COB chip directly contact MCPCB, and MCPCB can be regarded as its heat sink. However for SMD and high power chip, the heat dissipates from a point rather tha a face like COB chip. Therefore COB chip gets better thermal management than SMD and high power chip.
- The better heat resistance and better thermal management can minimize the light decay and extend the life-span of LED. So COB chip gets longer life-span than that of SMD & high power chip.
- COB can also be used as a small device like a flash of the smart phone and camera. This small COB chip can use little energy to produce a large amount of light.
There are numerous advantages of using COB metal core PCBs, some of which are as given below
- One of the biggest advantages of utilizing a COB metal core PCB is that it helps you improve your time to market capability.
- These metal core PCBs have an excellent heat dissipation capability.
- They have a very good thermal conductivity of 137W/m.K.
- These PCBs have a better heat dispatch property, and require a lesser number of solder joints as compared to the other types. This increases the reliability of these PCBs.
- High power LEDs can be easily assembled on the Chip-on-Board metal core PCBs.
- The use of COB metal core PCBs improve the lifespan, as well as the reliability of the LEDs.
- The material and production process used for these PCBs are of high quality. This is responsible for making the assembly easier, and decreases the error percentage in the assembly process by a considerable amount.
- These PCBs consume less space, and thus lesser costs.
- The metal core PCBs have an enhanced security protection, and are very hard to hack using reverse engineering technique.
The several advantages of Chip-on-Board Metal Core PCBs make them popular among a number of different applications. Some of the major applications, which use these PCBs are:
- Electronics Lighting
- High Power LED (up to 200W)
- Power Supply
- LED Backlight for LED TV
- Automotive
- LED Front Light for E-Book
- Street & Parking Lot Lighting
- Agriculture & Horticulture Lighting
- Other products that require thermal solutions
COB process consists of three main categories to perform when manufacturing the Chip-on-Board:
1st: 'die mount or die attach';
2nd: 'wire bonding';
3rd: 'the encapsulation of die wires'.
By using wire bonding & epoxy packaging then directly embedded on MCPCB, this practice can extend the lifespan of LED and unified light emission.
Chip-on-Board metal core PCB manufacturer
JHY PCB has a strong backing of more than 9 years of experience in manufacturing flexible PCB and rigid flex PCB. With a team of trained and knowledgeable professionals, we provide sturdy PCBs that can withstand extreme conditions. We are known to provide the fastest turnaround times. To know more about the Chip-on-Board metal core PCB, and other types of metal core PCBs available with us, please contact us at the earliest.
Metal Core PCB manufacturing
Metal Core PCB manufacturing Capabilities
Below are the capabilities of the Single Layer metal core PCB at PCBJHY.COM
Feature | Technical Specification |
Layers | 1 |
Material | Aluminum core FR4 prepreg Copper Iron Alloy |
Board Thickness | 0.5mm~3.0mm(0.02"~0.12") |
Copper thickness | 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 10 OZ |
Outline | Routing, punching, V-Cut |
Thermal Conductivity (dielectrial layer) | 0.8, 1.0, 1.5, 2.0, 3.0 W/m.K. |
Surface | HAL lead-free chemical gold immersion tin |
Initial copper | 35µm (for 1.5mm) 140µm (for 2.0mm) |
Finishes | SMOBC (HASL) Immersion Gold Immersion Silver |
Surface Finish | HASL OSP Immersion Gold |
Inspection Methods | 100% Visual Inspection Cross Sectioning Sample Lot Inspection Electrical Testing |
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Specifications | Min. conductor width-150µm Maximum Number of Layers: 1- 20 Minimum Line Spacing and Line Width: 3 MIL |
Packing | Vacuum/Plastic bag |
Samples L/T | 4~6 Days |
MP L/T | 5~7 Days |
Why choose us?
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- Minimum orders 1pcs.
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Certification(UL:E466618, TS16949, ISO9001.RoHS)
Quality is one of the cornerstones in Global Success' business. We work actively with continuously improvements to secure a high quality level on our products as well as our services. To satisfy our customers we focus on producing PCB with stable top quality. We have implemented the UL:E466618, TS16949, ISO9001.RoHS quality system. The perfect quality assurance system and with various inspection equipment`s help us to monitor the whole production process, assure stability of this process and high product quality, meanwhile, advanced instruments and technology methods have been introduced to attain sustained improvement.
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Product Categories : Metal Core PCB